（code：SS）
Silica filler is used mainly as sealing filler for silicon chips of ICs. The silica filler has excellent properties, such as very low coefficient of thermal expansion, high fluidity, high packing density, and reduced damage to the material in contact when it is packed.
Features
High purity (non crystal silica)
High sphericity (high roundness)
High flowability
High filling density
Low thermal expansion ratio
Electrical insulation property
Low water absorption property
Applications
Semiconductor encapsulation material filler
Coating materials
Filler material for various kinds of resin
Grit size
